Splash control sputter coaters evaporation method and what is the distinguishing feature of magnetron sputtering method
Magnetron sputtering at present of metal not conductive membrane manufacturers, give priority to with dc magnetron sputtering method, and USES the cylindrical target. Such an approach, and divided into two kinds: continuous and intermittent plated on 1. Continuous magnetron sputtering lines: relatively, continuous magnetron sputtering production line in terms of technical and practical controllability, already quite mature, make products according to the normal process, is also very perfect. The only downside is that the machine cost is high, market threshold is high, so put into use on the market less. Because of the aircraft production capacity and quality advantages, only have enough money and business resources, this process is recommended. 2: intermittent magnetron sputtering method: the technology itself has more objective flaw, and it is now so far a global problem. So, this process is just to stay under 1200 mm small equipment and high value-added products. Do mobile phone accessories in this process, in terms of production capacity and quality will not be able to compete with counterparts in other process. So, don't encourage using this method. Combining with the above situation, the current market average evaporation method is used to metal non-conductive plating membrane,
Multi arc ion coating machine for you to promote the evaporation of vacuum coating equipment, light coating machine in the production of this kind of equipment is divided into horizontal and vertical machine two, in the production of metal conductive film in general and USES vertical type: this is currently on the market do not conductive metal film the mainstream of the equipment; Horizontal machine, making the products in terms of quality has incomparable advantage, vertical machine but on efficiency is better than vertical machine, so give up horizontal machine basically by vacuum coating manufacturer.
