Physical Vapor Deposition Coating Techniques

The main vacuum coaitng method :PVD (Vacuum evaporation). Sputtering (Vacuum sputtering), ion plating .

1. Vacuum deposition

Vacuum deposition is plating material is heated in a vacuum, evaporation, so that evaporation of the atom or atomic group at a lower temperature of the substrate, thereby forming a film. When the kettle to boil water to make steam out of the windows covered with a layer of water vapor similar to blur. It is the use of resistance heating, high frequency induction heating or high energy beam (electron beam, laser beam, ion beam) bombardment coating material into vapor, and the deposition surface of the substrate to a mature technology.

Resistance heating means inexpensive, simple, widely used for Au, Ag, Cu, Ni, Cr and other semiconductor materials and the resistive material deposition, except for special materials, almost can meet the requirements of the coating. Electron-beam evaporation method is used for the production of the semiconductor industry, as demanding as the purity of the insulator film and the evaporation, Al deposition of high-speed, high-melting material deposition and the like.

2. Sputtering

Sputtering is a phenomenon of film formation by sputtering method. Sputtering phenomenon like throwing an iron ball on the gravel, gravel will be Zhuangfei out that. Sputtering under an argon gas is filled in the vacuum conditions, the glow discharge technique, argon gas was ionized argon ion (Ar +), argon ion under the action of the electric force acceleration bombardment cathode, the cathode materials (coating materials ) are sputtered down, deposited onto the surface coating method of forming. Sputtered film is divided into DC sputtering, RF magnetron s​puttering and sputtering.

Recent studies have focused on the sputtering in the sputtering film formation rate increase, reducing the sputtering gas pressure and a controlled ion beam sputtering and so on.

Cheap shot coating method in many areas of production of integrated circuits, various types of flat panel displays, electronic components production and optical, watch industry, etc., are rapid promotion and universal application, it has become the core technology of thin films.

3. Ion plating

Ion plating is under vacuum, using a variety of gas-discharge technology evaporated atoms are partially ionized into a plasma, and produce large amounts of high neutral particle, coating deposited on the workpiece surface is formed. Ion plating and vacuum deposition; sputtering fundamental difference in the first two coating over substrate during potentials are zero, and in the ion plating process, the need to add certain amplitude negative bias on the substrate, although the ion plating method than vacuum evaporation and sputtering